2025. aastal ilmunud või uuendatud standardid on siin:
IPC-A-600M, Acceptability of Printed Boards – IPC-A-600M is the definitive illustrated guide to printed board acceptability! This four-color document provides photographs and illustrations of the target, acceptable and nonconforming conditions that are either internally or externally observable on bare printed boards. Make sure your operators, inspectors, and engineers have the most current industry consensus information. With dozens of new or revised photographs and illustrations, IPC-A-600M provides new and expanded coverage on topics such as printed board edge plating, printed board cavities, edge burrs, dewetting, conductor thickness, annular ring (registration) internal copper penetration and plating voids. The document synchronizes to the acceptability requirements expressed in IPC-6012F and IPC-6013E. Supersedes IPC-A-600K.
IPC-4203C, Cover and Bonding Material for Flexible Printed Circuitry – This standard establishes the classification system, the qualification and quality conformance requirements for dielectric films coated with an adhesive on one or both sides, which are to be used as cover material and/or bondply for flexible printed circuitry, and supported or unsupported adhesive films to be used in the fabrication of flexible printed circuitry.
IPC-8911, Requirements for Conductive Yarns for E-Textiles Applications – This standard identifies categories and establishes a designation system and qualification/quality conformance requirements and test methods for conductive yarns used in e-textiles. The standard enables suppliers of conductive yarns to demonstrate their products’ performance against real-world processing and end-use environments, leveraging eight IPC Test Methods developed specifically for conductive yarns.
IPC-8981, Quality and Reliability of E-Textile Wearables – This standard defines classification levels and testing thresholds to assess the reliability of e-textile wearables in their intended end-use environments. It establishes baseline criteria for evaluating durability under mechanical stressors—such as abrasion, flexing, and UV exposure—and environmental conditions including perspiration, washing, water/saltwater, alkalis, and acids. Supported by 14 IPC Test Methods developed specifically for e-textile products, the standard also provides guidance for identifying affected and critical areas for reliability testing.
IPC-1602A, Standard for Printed Board Handling and Storage – The industry’s sole standard on the handling, packaging and storage of printed boards. The requirements in this document are intended to protect printed boards from contamination, physical damage, solderability degradation, ESD and moisture uptake. Consideration is given to packaging material types and methods, production environment, handling and transport of product, and establishing baking profiles for moisture removal. This document addresses the impact of baking on printed board solderability, moisture concerns for etched cores and composites, dry packaging requirements including moisture barrier bags (MBBs), desiccant material and HIC cards, test coupons for evaluating relative moisture absorption and guidance for floor life and rework by baking. Supersedes IPC-1602.
IPC-6011A, Generic Performance Specification for Printed Boards – This specification establishes the generic requirements for printed boards associated with the IPC-601X series of performance specifications and their quality and reliability assurance requirements. The intent of this specification is to allow the printed board user and supplier flexibility to develop optimum procedures for the procurement and manufacture of printed boards. For use with IPC-6012 through IPC-6018. Supersedes IPC-6011.
IPC-9716, Requirements for Automated Optical Inspection (AOI) Process Control for Printed Board Assemblies – IPC-9716 provides requirements for automated optical inspection (AOI) systems to define, set up, establish, and apply process control for manufacturing printed board assemblies, including general and specific process and AOI system conditions. Requirements include inspection parameters, lighting conditions, calibration, detectability, resolution, threshold limits, program setups, measurement system analysis (MSA), maintenance, and verification protocols.
IPC/JEDEC-J-STD-609C, Marking, Symbols, and Labels of Leaded and Lead-Free Terminal Finished Materials Used in Electronic Assembly – This standard provides a marking and labeling system that aids in assembly, rework, repair and recycling and provides for the identification of: 1. those assemblies that are assembled with lead-containing or lead-free solder; 2. components that have lead-containing or lead-free second level interconnect terminal finishes and materials; 3. the maximum component temperature not to be exceeded during assembly or rework processing; 4. the base materials used in the PCB construction, including those PCBs that use halogen-free resin; 5. the surface finish of PCBs; and the conformal coating on PCBAs.
IPC-7530B, Guidelines for Temperature Profiling for Mass Soldering Processes (Reflow and Wave) – This document provides useful and practical information for developing thermal profiles to produce acceptable SnPb and Pb-free electronics assemblies using reflow, vapor phase, laser, selective and wave soldering equipment. The document also includes a troubleshooting guide for addressing common defects which can be attributed to profiling.
IPC-2591 – Version 2.0, Connected Factory Exchange (CFX) – This standard establishes the requirements for the omnidirectional exchange of information between manufacturing processes and associated host systems for assembly manufacturing. This standard applies to communication between all executable processes in the manufacture of printed board assemblies, automated, semiautomated and manual, and is applicable to related mechanical assembly and transactional processes. IPC-2591, Version 2.0 includes enhancements for hand soldering, wave soldering, gateway solutions, autonomous mobile robots (AMR) and adds requirements for declarations of support for listings on the CFX Qualified Products List (QPL).