2025. aastal ilmunud või uuendatud standardid on siin:
IPC-1602A, Standard for Printed Board Handling and Storage – The industry’s sole standard on the handling, packaging and storage of printed boards. The requirements in this document are intended to protect printed boards from contamination, physical damage, solderability degradation, ESD and moisture uptake. Consideration is given to packaging material types and methods, production environment, handling and transport of product, and establishing baking profiles for moisture removal. This document addresses the impact of baking on printed board solderability, moisture concerns for etched cores and composites, dry packaging requirements including moisture barrier bags (MBBs), desiccant material and HIC cards, test coupons for evaluating relative moisture absorption and guidance for floor life and rework by baking. Supersedes IPC-1602.
IPC-6011A, Generic Performance Specification for Printed Boards – This specification establishes the generic requirements for printed boards associated with the IPC-601X series of performance specifications and their quality and reliability assurance requirements. The intent of this specification is to allow the printed board user and supplier flexibility to develop optimum procedures for the procurement and manufacture of printed boards. For use with IPC-6012 through IPC-6018. Supersedes IPC-6011.
IPC-9716, Requirements for Automated Optical Inspection (AOI) Process Control for Printed Board Assemblies – IPC-9716 provides requirements for automated optical inspection (AOI) systems to define, set up, establish, and apply process control for manufacturing printed board assemblies, including general and specific process and AOI system conditions. Requirements include inspection parameters, lighting conditions, calibration, detectability, resolution, threshold limits, program setups, measurement system analysis (MSA), maintenance, and verification protocols.
IPC/JEDEC-J-STD-609C, Marking, Symbols, and Labels of Leaded and Lead-Free Terminal Finished Materials Used in Electronic Assembly – This standard provides a marking and labeling system that aids in assembly, rework, repair and recycling and provides for the identification of: 1. those assemblies that are assembled with lead-containing or lead-free solder; 2. components that have lead-containing or lead-free second level interconnect terminal finishes and materials; 3. the maximum component temperature not to be exceeded during assembly or rework processing; 4. the base materials used in the PCB construction, including those PCBs that use halogen-free resin; 5. the surface finish of PCBs; and the conformal coating on PCBAs.
IPC-7530B, Guidelines for Temperature Profiling for Mass Soldering Processes (Reflow and Wave) – This document provides useful and practical information for developing thermal profiles to produce acceptable SnPb and Pb-free electronics assemblies using reflow, vapor phase, laser, selective and wave soldering equipment. The document also includes a troubleshooting guide for addressing common defects which can be attributed to profiling.
IPC-2591 – Version 2.0, Connected Factory Exchange (CFX) – This standard establishes the requirements for the omnidirectional exchange of information between manufacturing processes and associated host systems for assembly manufacturing. This standard applies to communication between all executable processes in the manufacture of printed board assemblies, automated, semiautomated and manual, and is applicable to related mechanical assembly and transactional processes. IPC-2591, Version 2.0 includes enhancements for hand soldering, wave soldering, gateway solutions, autonomous mobile robots (AMR) and adds requirements for declarations of support for listings on the CFX Qualified Products List (QPL).