2021. a. ilmunud IPC standardi

2021. a. ilmunud IPC standardi

Saadaval on uus versioon Tööstus 4.0 aluseks olevast standardist IPC-2591

IPC Standardid 2021

2021. aastal ilmunud või uuendatud standardid on siin:

IPC-4552B, Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Boards – IPC-4552B standard sets the requirements for Electroless Nickel / Immersion Gold (ENIG) deposit thickness for applications including soldering, wire bonding, and as a contact finish. IPC-4552B standard is used to specify acceptance criteria to meet performance standards for IPC-6010 family of documents including IPC-6012, IPC-6013 and IPC-6018. The ENIG deposit specified using this document will meet the highest coating durability rating as specified in IPC-J-STD-003 printed board solderability specification.

IPC-2591-Version 1.3, Connected Factory Exchange (CFX) – Establishes the requirements for the omni-directional exchange of information between manufacturing processes and associated host systems for assembly manufacturing. This standard applies to communication between all executable processes in the manufacture of printed board assemblies, automated, semi-automated and manual, and is applicable to related mechanical assembly and transactional processes. IPC-2591, Version 1.3 provides updates to several IPC-CFX messages as well as mandatory and optional IPC-CFX message by equipment type. Visit www.ipc.org/ipc-cfx for software developer resources and information on the equipment validation system for IPC-CFX implementations.

IPC-HDBK-001H, Handbook and Guide to Supplement J-STD-001 – The IPC-HDBK-001H is a companion document to J-STD-001, Requirements for Soldered Electrical and Electronic Assemblies providing guidance and supporting information for the requirements found in the standard. IPC-HDBK-001H is structured to map paragraph-to-paragraph with the standard, it includes the “how-to” and “why” behind many of the criteria in an easy-to-use reference handbook.

IPC-6902, Qualification and Performance Specification for Printed Electronics on Flexible Substrates – Establishes and defines the qualification and performance requirements for printed electronics and the forms of component mounting and interconnecting structures on flexible substrates. IPC-9257 should be purchased along with this standard.

IPC-9257, Requirements for Electrical Testing of Flexible Printed Electronics – Assists in selecting the test equipment, test parameters, test data and fixturing required to perform electrical test(s) on flexible printed electronics. IPC-6902 should be purchased along with this standard.

IPC-J-STD-001HS, Space and Military Applications Electronic Hardware Addendum to IPC J-STD-001H Requirements for Soldered Electrical and Electronic AssembliesSupplements or replaces specifically identified requirements of IPC J-STD-001H requirements for soldered electrical and electronic assemblies that must survive the vibration and thermal cyclic environments of getting to and operating in space and military applications.