2022. aastal ilmunud või uuendatud standardid on siin:
IPC-4555, Performance Specification for High Temperature Organic Solderability Preservatives (OSP) for Printed Boards – Standard covers the requirements and testing for organic solderability preservatives (OSP) processes for printed boards to be used primarily for electrical and electronic circuits.
IPC-7526A, Stencil and Misprinted Board Cleaning Handbook – Handbook addresses understencil cleanliness during stencil printing, removal of solder paste from stencils following the cleaning process and misprint PCB board cleaning considerations.
IPC-9121A, Troubleshooting for Printed Board Fabrication Processes – Handbook provides problems, causes and possible corrective actions related to printed board manufacturing processes. Includes more than 200 photos and illustrations depicting common defects.
IPC-9701B, Thermal Cycling Test Method for Fatigue Life Characterization of Surface Mount Attachments – Standard establishes a thermal cycling test method to characterize the fatigue lifetimes of surface mount solder attachments of electronic assemblies. The surface mount devices may be solder-attached to rigid, flexible or rigid-flex printed boards. The characterization results can be used to predict the field lifetime of solder attachments for the use environments and conditions of electronic assemblies.
IPC-Hermes-9852-Version 1.4, The Global Standard for Machine-to-Machine Communication in SMT Assembly – The IPC-Hermes-9552 v. 1.4 is an open industry standard, developed by The Hermes Initiative and approved by IPC. The IPC-Hermes-9542 provide a state-of-the-art communication protocol for machine-to-machine communication for surface-mount technology (SMT). Specifically, IPC-HERMES-9852, version 1.4 provides additional alignment with IPC-2591 (IPC-CFX).
Used with IPC-2591, Connected Factory Exchange, IPC-HERMES-9852 can assist any electronics manufacturer, large or small, to align their companies with smart manufacturing and Industry 4.0.
IPC-T-51, Terms and Definitions for Design and Manufacture of Printed Electronics – Standard provides terms and definitions for the design and manufacture of printed electronics. IPC-T-51 standard enables common language and understanding for the worldwide printed electronics community.
IPC-J-STD-004C, Requirements for Soldering Fluxes – Standard prescribes general requirements for the classification and characterization of fluxes for high quality solder interconnections. The IPC J-STD-004C standard may be used for quality control and procurement purposes.
IPC-4202C, Specification for Flexible Base Dielectrics for use in Flexible Printed Boards – Standard covers the requirements for flexible base materials, herein referred to as laminates, prepregs or films, to be used primarily for flexible printed boards for electrical and electronic circuits.
IPC-4412C, Specification for Finished Fabric Woven from “E” Glass for Printed Boards – Standard covers the requirements for reinforcements woven from “E” glass yarn. These reinforcements are used in the production of prepregs, some of which are pressed into laminates. These prepregs and laminates are the base materials for rigid and multilayer printed boards. The IPC-4412C standard contains tables which describe each fabric style in detail including the yarn used, the number of yarns per unit area, the basis weight and the thickness. The IPC-4412C standard also includes the quality assurance aspects of these strategic building blocks for base materials.
IPC-6018D, Qualification and Performance Specification for High Frequency (Microwave) Printed Boards – Standard covers qualification and performance of high frequency (microwave) boards, including single-sided, double-sided, with or without plated-through holes, multilayer with or without blind/buried vias and metal core boards. It addresses final finish and surface plating coating requirements, conductors, holes/vias, frequency of acceptance testing and quality conformance as well as electrical, mechanical and environmental requirements. IPC-6018D incorporates many new requirements in areas such as back-drilled holes, alternative surface finishes, pad/land anomalies, microvia capture and target lands, copper cap plating of filled holes, copper filled microvias, plating overhang/slivers and dielectric removal. For use with IPC-6011.
IPC-7525C, Stencil Design Guidelines – Standard provides guidance for the design and fabrication of stencils for solder paste and surface-mount adhesive with much of the content based on the experience of stencil designers, fabricators, and users.
IPC-D-620A, Design and Critical Process Requirements for Cable and Wiring Harnesses – Standard provides design and critical process requirements for cable and wire harness assemblies as well as military/space applications. IPC-D-620A is the design requirements companion to IPC/WHMA-A-620, “Requirements and Acceptance for Cable and Wire Harness Assemblies,” and its associated Space Addendum.
Three white papers are included to provide guidance on key topics discussed in the Standard.
IPC-WP-113A, Guidance for the Development and Implementation of a Red Plague Control Plan (RPCP)
IPC-WP-114A, Guidance for the Development and Implementation of a White Plague Control Plan (WPCP)
IPC-WP-116A, Guidance for the Development and Implementation of a Foreign Object Debris (FOD) Control Plan
IPC-2591 Version 1.4, Connected Factory Exchange (CFX) – Standard establishes the requirements for the omnidirectional exchange of information between manufacturing processes and associated host systems for assembly manufacturing. IPC-2591 CFX standard applies to communication between all executable processes in the manufacture of printed board assemblies, automated, semi automated and manual, and is applicable to related mechanical assembly and transactional processes. IPC-2591, Version 1.4 updates several significant IPC-CFX messages as well as new messages to better align with IPC-HERMES-9852 and best utilization of IPC-2581 data. Visit www.ipc-cfx.org for software developer resources, training programs and information on the IPC-2591 CFX Validation System and Qualified Products List (QPL).
IPC-QRG-WHA-D, Wire Harness Assembly Training & Reference Guide – The IPC-DRM-WHA-D desk reference manual contains illustration/images of wire harness assemblies for IPC/WHMA-A-620D standard. IPC-QRG-WHA-D explains the basic acceptance criteria for wire harness assemblers, crimp operators, and QA personnel. The IPC-QRG-WHA-D is handy reference and training tool but does not replace the criteria found in IPC/WHMA-A-620D. IPC-QRG-WHA -D covers: wire types, gauges, insulation stripping, wire tinning, terminals and contact types, coaxial cables, IPC product categories and acceptance criteria, wire preparation, strand and insulation damage, conductor deformations, open and closed barrel crimp definitions and criteria, crimp deformations, cut-off tabs, punctures, insulation support crimps, inspection windows, bellmouth, conductor crimp requirements, conductor brush, closed barrel crimps, insulation damage, ribbon cable, discrete wire, cup terminals and a glossary of related wire harness terminology.
IPC-QRG-PTH-H, Through-Hole Solder Joint Evaluation Training & Reference Guide – The IPC-QRG-PTH-H desk reference manual contains illustration/images of through-hole solder connections for IPC-A-610H standard. As a convenient manual but not a replacement for IPC-A-610H standard, the IPC-QRG-PTH-H is an additional tool to help operators and inspectors when evaluating the three classes of product for solder joint acceptance. The IPC-QRG-PTH-H is a useful training aid as well. It can be used with other products to understand through-hole criteria when evaluating a components and solder joint acceptance.
IPC-QRG-18J, Component Identification Training and Reference Guide – The IPC-QRG-18J desk reference manual contains illustration/images of component identification, schematic symbols and more with detailed descriptions of commonly used components. The IPC-DRM-18J contains updated info on SSOP, TSOP, QFP, LQFP, PQFP, LCC, QFN, and BGA-related packages, including all the variations within those groups. New components include DFN, QFN – Multi Row, PoP (Package on Package), CSP (ChipScale Package), COB (Chip on Board), Bare Die and Flip Chip. The Terminology Section has quick facts on polarity, orientation, lead styles and Component Reference Designators (CRDs). The “Reading Component Values” section has full-color, easy-to-use color code charts for resistors and inductors, as well as charts for reading numbered capacitor data.