2021. aastal ilmunud või uuendatud standardid on siin:
IPC-2591-Version 1.3, Connected Factory Exchange (CFX) – Establishes the requirements for the omni-directional exchange of information between manufacturing processes and associated host systems for assembly manufacturing. This standard applies to communication between all executable processes in the manufacture of printed board assemblies, automated, semi-automated and manual, and is applicable to related mechanical assembly and transactional processes. IPC-2591, Version 1.3 provides updates to several IPC-CFX messages as well as mandatory and optional IPC-CFX message by equipment type. Visit www.ipc.org/ipc-cfx for software developer resources and information on the equipment validation system for IPC-CFX implementations.
IPC-HDBK-001H, Handbook and Guide to Supplement J-STD-001 – The IPC-HDBK-001H is a companion document to J-STD-001, Requirements for Soldered Electrical and Electronic Assemblies providing guidance and supporting information for the requirements found in the standard. IPC-HDBK-001H is structured to map paragraph-to-paragraph with the standard, it includes the “how-to” and “why” behind many of the criteria in an easy-to-use reference handbook.
IPC-6902, Qualification and Performance Specification for Printed Electronics on Flexible Substrates – Establishes and defines the qualification and performance requirements for printed electronics and the forms of component mounting and interconnecting structures on flexible substrates. IPC-9257 should be purchased along with this standard.
IPC-9257, Requirements for Electrical Testing of Flexible Printed Electronics – Assists in selecting the test equipment, test parameters, test data and fixturing required to perform electrical test(s) on flexible printed electronics. IPC-6902 should be purchased along with this standard.