2023. aastal ilmunud või uuendatud standardid on siin:

IPC-7352, Generic Guideline for Land Pattern Design – IPC-7352 Generic Guideline for Land Pattern Design provides generic guidelines on land pattern geometries used for the attachment of electronic components to a printed board, as well as design recommendations for achieving the best possible solder joints to the devices assembled. IPC-7352 is an essential tool for helping printed board designers to achieve these optimal results.

IPC-9797A, Press-fit Standard for Automotive Requirements and other High-Reliability Applications – IPC-9797A is the only industry-consensus standard for Requirements and Acceptance of Press-fit Pins. IPC-9797 describes materials, methods, tests and acceptance criteria for solderless press-fit pin connections. IPC-9797 is supported by IPC-HDBK-9798 “Handbook for Press-fit Standard for Automotive Requirements and other High-Reliability Applications” for those wanting additional information and explanation for press-fit technology.

IPC-2591 – Version 1.6, Connected Factory Exchange (CFX) – IPC-2591, Version 1.6 establishes the requirements for the omnidirectional exchange of information between manufacturing processes and associated host systems for assembly manufacturing. IPC-2591, Version 1.6 applies to communication between all executable processes in the manufacture of printed board assemblies, automated, semiautomated and manual, and is applicable to related mechanical assembly and transactional processes. IPC-2591, Version 1.6 includes the addition of an IPC-CFX message recorder, working time analysis breakdown, support for complex feeders, standardization of geometry rules and additional recipe controls. Visit www.ipc-cfx.org for software developer resources, training programs and information on the IPC-2591-CFX Validation System and Qualified Products List (QPL).

IPC-1791C, Trusted Electronic Designer, Fabricator and Assembler Requirements – IPC-1791C provides minimum requirements, policies and procedures for printed board design, fabrication, assembly, and cable and wire harness assembly organizations and/or companies to become trusted sources for markets requiring high levels of confidence in the integrity of delivered products. These trusted sources shall ensure quality, supply chain risk management (SCRM), security and chain of custody (ChoC). IPC-1791C includes updates to perimeter security, repeat orders, management of sample materials.

IPC-1792, Standard for the Management and Mitigation of Cybersecurity Incidents in the Manufacturing Industry Supply Chain – Standard establishes requirements for companies to provide assurance that their products have been manufactured in cybersecure environments, ensuring that there has been no risk of impact to the product due to any cybersecurity incident. IPC-1792 requirements specify actions that need to be taken if a cybersecurity incident is detected, identifying all possible affected products.

IPC-7091A, Design and Assembly Process Implementation of 3D Components – This document describes the design and assembly challenges and ways to address those challenges for implementing 3D component technology. Recognizing the effects of combining multiple uncased semiconductor die elements in a single-package format can impact individual component characteristics and can dictate suitable assembly methodology. The information contained in this standard focuses on achieving optimum functionality, process assessment, end-product reliability and repair issues associated with 3D semiconductor package assembly and processing.

IPC-8952, Design Standard for Printed Electronics on Coated or Treated Textiles and E-Textiles – Standard establishes specific requirements for the design of printed electronic applications and their forms of component mounting and interconnecting structures on coated or treated textile substrates. Textile substrate, as pertains to IPC-8952 standard, could be a bare textile or an integrated e-textile (e.g., woven or knitted e-textile). Coated or treated textile substrates, as pertain to IPC-8952 standard, are textile substrates which have or will have a coating or treatment localized or across the full substrate.

IPC-8971, Requirements for Electrical Testing of Printed Electronics E-Textiles – Document is intended to assist in selecting the test equipment, test parameters, test data and fixturing required to perform electrical test(s) on printed electronics on e-textiles. Printed electronics on e-textiles is printed electronics on coated or treated textile substrates. Coatings and treatments may be applied for printability of the textile substrate and/or for performance of the textile substrate or finished printed electronics e-textile (e.g., hydrophobic, water retardance, flame retardance, surface energy). Coatings or treatments may be applied using printing, lamination or other processes.

IPC-9203A, Users Guide to IPC-9202 and the IPC-B-52 Standard Test Vehicle – While there are a variety of industry test vehicles for the examination of material compatibility, the IPC-B-52 test board was created to meet the needs for testing both ion chromatograph and surface insulation resistance (SIR) which would be more representative of the manufacturing materials and processes. IPC-9203A standard addresses the IPC-B-52 test vehicle, which can be used to evaluate a manufacturing process, or to provide objective evidence that a chosen manufacturing material set, and process are compatible, from a cleanliness standpoint. IPC-9203A user guideline has been written as a companion document to the IPC-9202, providing clarification on what a manufacturer “should” do and what they “must” do for demonstrating material and process compatibility.

IPC J-STD-003D, Solderability Tests for Printed Boards – The standard describes solderability determinations that are made to verify that the printed board fabrication processes and subsequent storage have had no adverse effect on the solderability of those portions of the printed board intended to be soldered. Solderability is determined by evaluation of a test specimen which has been processed as part of a panel of boards and subsequently removed for testing per the method selected. IPC J-STD-003D provides solderability test methods to determine the acceptance of printed board surface conductors, attachment lands, and plated-through holes to wet easily with solder, and to withstand the rigors of the printed board assembly processes.

IPC J-STD-004C WAM1, Requirements for Soldering Fluxes – The standard prescribes general requirements for the classification and characterization of fluxes for high quality solder interconnections. The IPC J-STD-004C WAM1 standard may be used for quality control and procurement purposes. Soldering flux materials include the following: liquid flux, paste flux, solder paste, solder cream as well as flux-coated and flux-cored solder wires and preforms. It is not the intent of the IPC J-STD-004C WAM1 standard to exclude any acceptable flux or soldering material; however, these materials must produce the desired electrical and metallurgical interconnection.

IPC/JEDEC J-STD-020F, Moisture/Reflow Sensitivity Classification for Non-hermetic Surface Mount Devices (SMDs) – Standard is to identify the classification level of nonhermetic SMDs designed for surface mount assembly that are sensitive to moisture-induced stress so that they can be properly packaged, stored, and handled to avoid damage during assembly solder reflow attachment and/or repair operations. IPC/JEDEC J-STD-020F standard may be used to determine what classification level should be used for nonhermetic SMD qualification. Passing the criteria in this test method is not sufficient by itself to provide assurance of long-term reliability. The Moisture Sensitivity Levels (MSLs) rating generated for an SMD by this document is utilized to determine the soak conditions for preconditioning as per JESD22-A113 and how the SMD can be properly packaged, stored, and handled to avoid damage during assembly solder reflow attachment and/or repair operations as per J-STD-033. For IC devices that may be process sensitive, please refer to J-STD-075 to determine if a PSL (Process Sensitivity Level) classification is required.

IPC/JEDEC J-STD-035A, Acoustic Microscopy for Nonhermetic Encapsulated Electronics Devices – Test method defines the procedures for performing acoustic microscopy on nonhermetic encapsulated electronic devices. IPC/JEDEC J-STD-035A method provides users with an acoustic microscopy process flow for detecting anomalies (delaminations, cracks, mold compound voids, etc.) nondestructively in encapsulated electronic devices while achieving reproducibility.